Wood Floor Bonding with SikaBond

Wood Floor Bonding Systems Description

Cordon application system

This is an economical and easy-to-apply system for wood floor bonding in residential and office building, where acoustics  requirement is not very high.

This application method can be used for solid wood board as well as 3-ply engineered wood and is suitable for all types of wood, including problematic woods  like beech or bamboo.

Full surface bonding system

This is a high safety adhesive system for use  in residential, commercial or industrial buildings where very high adhesion and high  acoustics performance is required.

This application method can be used for solid and engineered wood floor, mosaic parquet, wood paving and industrial parquet. All types of wood, including problematic  woods like beech or bamboo can be safely bonded.

Tools Required

Surface preparation: grinding machine, industrial vacuum cleaner

SikaBond® T55(J): caulking gun, notched trowel.

Bonding Application

Cordon Application

Following the adequate surface preparation (levelling, priming and cleaning):

1. Place the opened unipack of SikaBond® T55(J) in the sealant gun

2. Holding nozzle at right angle to the substrate, extrude a triangular shaped bead of adhesive of approx. 10mm high x 8 mm wide at 150 mm distance

3. Press the wood pieces firmly into the adhesive before skinning time.

4. The wood should be firmly tapped together with a hammer using an  impact block.

5. A gap of 10-15mm between wood and wall should be observed.

6. Weights to hold the wood in place until the adhesive is fully cured might be required (especially for solid wood)

7. Fresh, uncured adhesive remaining on the wood floor must be removed  immediately with a cloth impregnated of Sika® Remover 208.

8. After a minimum of 18-24 hours waiting time the wood can be grinded  and finished as required

9. Consumption: one 600ml unipack yield approx. 2m2

Full surface Application

Following the adequate surface preparation (levelling, priming and cleaning):

1. Open the 2kg unipack of SikaBond® T55(J) and pour the adhesive on the surface.

2. Spread the adhesive evenly using a notched trowel

3. Press the wood pieces firmly into the adhesive before skinning time.

4. The wood should be firmly tapped together with a hammer using an impact  block.

5. A gap of 10-15mm between wood and wall should be observed.

6. Weights to hold the wood in place until the adhesive is fully cured might be  required (especially for solid wood)

7. Fresh, uncured adhesive remaining on the wood floor must be removed  immediately with a cloth impregnated of Sika® Remover 208.

8. After a minimum of 18-24 hours waiting time the wood can be grinded and  finished as required

9. Consumption: one 2kg unipack yield approx. 2m2

Safety Precautions

Wear protective clothing during application.

Sufficient ventilation must be provided in closed rooms

For more information, please refer to our Material Safety Data Sheet (available on  request).